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Solvent-free compound machine

WRJB-B500 High Speed Solvent-Free Compound Machine

From: Jiangxi Beidemeike Machine Tech Inc.  Date:2017-11-30 14:58:51  Hits:1502  Belong to:Solvent-free compound machine

主要技術參數 Main Technical Data

 

最大復合速度

Max. Laminating Speed

400mpm

最大料帶寬度

Max. Web Width

1250mm

最大放卷直徑

Max. Unwinding Dia.

800mm

最大收卷直徑

Max. Rewinding Dia.

1000mm

芯管內徑

Core I.D.

3 or  6

外形尺寸

Dimensions

6000(L) x 3000/3300/3500 (W) x 2700(H) mm

裝料方式

Reel Fixing

氣脹軸+安全卡盤

Expanding Shafts or Shaftless with Air-chucks


 

產品特點:

模塊化設計                   使機器安裝,日常使用更加容易

五輥涂布單元            計量輥,轉移輥,涂布輥單獨電機驅動,事先高精度涂布;

                                     三輥內部采用雙層內膽螺旋導流結構,輥面溫度均勻,上膠量恒定;

                                     定輥單獨電機驅動,便于日常清洗;

復合單元                  熱輥,高密度橡膠輥和背壓輥三輥符合結構,確保符合品質;

張力控制                    全數字化張力控制,人機界面設定,控制精準而恒定。

 

Product features:

Modular design makes it easier to install and use machines

5 roller coating unit metering roll, transfer roll, coating roller single motor drive, high precision coating;

The inside of the three-roller adopts double inner helical guide flow structure, the roller surface temperature is uniform and the amount of gluing is constant.

The fixed roller is driven by a single motor for daily cleaning.

Compound unit hot roller, high density rubber roller and back roller three roll fit the structure to ensure the quality;

Tension control all digital tension control, human-machine interface setting, control precision and constant.

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